Parylene HT
1,1,2,2,9,9,10,10-Octafluoro[2.2]paracyclophane
CAS: 3345-29-7
Molecular Formula: C16H8F8
Parylene HT - Names and Identifiers
| Name | 1,1,2,2,9,9,10,10-Octafluoro[2.2]paracyclophane |
| Synonyms | Parylene HT PARYLENE HT Parylene-AF4 2,2,3,3,8,8,9,9-Octa parylene AF4(parylene HT) 1,1,2,2,9,9,10,10-Octafluoro[2,2]paracyclophane 1,1,2,2,9,9,10,10-Octafluoro[2.2]paracyclophane 2,2,3,3,8,8,9,9-Octafluorotricyclo[8.2.2.24,7]hexadeca-4,6,10,12,13,15-hexaene Tricyclo[8.2.2.24,7]hexadeca-4,6,10,12,13,15-hexaene, 2,2,3,3,8,8,9,9-octafluoro- 2,2,3,3,8,8,9,9-octafluorotricyclo[8.2.2.2~4,7~]hexadeca-1(12),4,6,10,13,15-hexaene Tricyclo[8.2.2.24,7]hexadeca-4,6,10,12,13,15-hexaene, 2,2,3,3,8,8,9,9-octafluoro Tricyclo[8.2.2.24,7]hexadeca-4,6,10,12,13,15-hexaene, octafluoro |
| CAS | 3345-29-7 |
| InChI | InChI=1/C16H8F8/c17-13(18)9-1-2-10(4-3-9)14(19,20)16(23,24)12-7-5-11(6-8-12)15(13,21)22/h1-8H |
| InChIKey | KCKIWSAAWFKXMA-UHFFFAOYSA-N |
Parylene HT - Physico-chemical Properties
| Molecular Formula | C16H8F8 |
| Molar Mass | 352.22 |
| Density | 1.47±0.1 g/cm3(Predicted) |
| Melting Point | 240-250°C |
| Boling Point | 259.3±40.0 °C(Predicted) |
| Flash Point | 96°C |
| Vapor Presure | 0.0211mmHg at 25°C |
| Appearance | powder |
| Refractive Index | 1.489 |
Parylene HT - Nature
Open Data Verified Data
parylene has excellent electrical properties, heat resistance, weather resistance and chemical stability as well as radiation resistance, dimensional stability and other characteristics. Due to the use of vacuum pyrolysis gas phase deposition film forming process, can be made of a fraction of the micron thin film, the ultra small capacitor made of it is only 1/5 of the volume of polystyrene thin film capacitor.
Last Update：2024-01-02 23:10:35
Parylene HT - Preparation Method
Open Data Verified Data
parylene mainly has the above three kinds of structure products, the preparation method is similar, basically using the vapor deposition method to prepare thin films.
- parylene cyclodimer preparation p-xylene and water vapor are mixed according to the ratio of the amount of the substance, first preheated to 700 ℃ and sent to a 950~1000 ℃ pyrolysis furnace to generate p-xylene double radical, the cracking gas is further cooled to 200 to 400 ° C. And introduced into an inert organic solvent such as toluene, xylene or p-xylene at about 90 ° C. For absorption. Evaporation of the solvent to make it concentrated, cooling, the crystallization of the precipitation, filtered to the xylene Ring Two, refined product melting point of 283~285.
- p-xylene cyclo-dimer ring-opening polymerization the refined p-xylene cyclo-dimer is placed in a sublimation chamber, sublimated at 100~200 ℃, and the steam enters the preheating chamber to heat up to 300~400 ℃, then enter the heater at 500~650 ℃ to cause ring-opening and regeneration of double free radicals by ring-opening pyrolysis of the ring-dimer, and then introduce it into the film-forming chamber to condense and rapidly polymerize on the surface of the object to be formed, uniform and dense film without pinhole can be obtained, and the residual pressure of the film forming system is generally less than 133. 3Pa.
Last Update：2022-01-01 11:09:36
Parylene HT - Use
Open Data Verified Data
parylene is mainly used for thin films and coatings. The film thickness of vapor deposition polymerization on the metal belt can reach 0.6 ~ 5um, and the volume of the capacitor made with it can be greatly reduced. Parylene N film is used for electrical insulation of electronic components. Parylene C is mostly used in protective coatings and encapsulating materials. It is coated on polyethylene and polystyrene films, which not only maintains the optical properties of the matrix, but also improves their solvent resistance and gas barrier properties. As a special moisture-proof and anti-corrosion coating, parylene can be used as encapsulating material for paper, fiber and metal adhesive.
Last Update：2022-01-01 11:09:36
